Teach you how to choose radiator correctly and effectively

Teach you how to choose radiator correctly and effectively


Radiator, as one of the necessary accessories in the computer, plays a very important role in the stability and overclocking of the system. The radiator in the market is dazzling, the quality is uneven, really dazzling, so how can you choose a suitable product in the radiator? For cost-effective users, the natural hope is to spend less money to buy a good performance radiator. This can not only ensure the stability of the whole machine, but also do not cause unnecessary waste. Therefore, before buying radiators, we need to know the factors that affect the radiator, to be able to choose a reasonable.


Including the main factors affecting the performance of a heat sink: cooling mode (direct blowing, blowing, heat sink) material and the cutting process of the heat sink, contact radiator, heat pipe quantity and heat pipe cooling efficiency, fan speed and bearing type. The author of these points for everyone to sort out some of the radiator professional knowledge.


The direct blow type heat dissipation is more common, in Intel or AMD original radiator, often use this type. Straight blow type radiator, the wind blows from the top of the radiator, the advantage of this structure is to be able to take care of the equipment around the radiator, the disadvantage is that the heat generated easily deposited in the box, the need to cooperate with the cooling fan to extract the heat inside the chassis.


The characteristics of side blowing type radiator is the biggest fan mounted on the side of the heat sink, it has the advantage of wide coverage rate. The airflow direction side blowing fan generated parallel with the main board, so as not to affect the air inside the enclosure, is conducive to the smooth duct inside the chassis, very suitable for the DIY game player needs cooling limit. The material and cutting process of heat sink.


In the minds of many users, the radiator is believed to be heat conduction faster material, will quickly take the heat of the processor, to achieve good heat dissipation effect. Indeed, the thermal conductivity of the material, so that the heat dissipation of the processor better.


In the heat sink material, although gold and silver thermal conductivity is the best, but the manufacturing cost is too high! The remaining options are only copper and aluminum, but the two have their own advantages and disadvantages - copper has strong thermal conductivity, but poor heat dissipation performance; poor thermal conductivity of aluminum, heat dissipation performance is strong. Therefore, some radiator manufacturers in the manufacture of radiators will choose the combination of copper and aluminum, heat absorption in the choice of pure copper base or pure copper heat pipe, radiator in the choice of aluminum flake. At present, some radiator manufacturers will use nickel plating on heat sink and heat pipe, so the advantage is to effectively prevent oxidation.


The hybrid contact technology is to directly insert the polished heat pipe onto the seat, so that the heat pipe is directly connected with the CPU, thus increasing the utilization ratio of the heating pipe. The two technology is only slightly different in the process and shape.


Compared with the previous connection mode, the biggest role of this hybrid method is to increase the utilization ratio of heat pipes, and save the cost in comparison, but it does not mean that the heat dissipation effect is good, and the heat conduction effect depends on the overall design of the radiator. What are the types of heat pipes and the heat dissipation efficiency? Simply speaking, it is a heat transfer element with extremely high thermal conductivity. It transfers heat through the evaporation and condensation of liquid in the closed vacuum tube. It uses the principle of fluid absorption such as hair absorption to achieve the refrigeration effect similar to that of the refrigerator compressor. It has a series of advantages, such as high thermal conductivity, excellent isothermal property, variability of heat flux density, reversibility of heat flow direction, and long distance transfer